Semiconductor Innovations for Next-Generation Technology Ecosystems

Semiconductor technology stands at the forefront of innovation, driving the evolution of next-generation technology ecosystems. Its potential to redefine the landscape of various industries, optimize performance, and enable novel applications presents an unparalleled opportunity to reshape our technological foundations. The secure and efficient design of semiconductor systems, offering high reliability and performance, has garnered global attention. Semiconductors are poised to play a pivotal role in shaping emerging fields such as edge computing, the Internet of Things (IoT), artificial intelligence, automotive electronics, renewable energy systems, and advanced telecommunications. Consequently, semiconductor technology will significantly disrupt the operation and development of digital and networking systems, including IoT.

However, the application of semiconductor technology presents complex challenges and demands, with open issues and opportunities for breakthroughs in scalability, security, power efficiency, miniaturization, flexibility, availability, and high reliability of devices crucial to advancing its further evolution. The proposed special session aims to gather, disseminate, and investigate cutting-edge research contributions, innovative techniques, novel applications, and advanced methodologies that address various aspects of semiconductor technology, especially for accelerating intelligent applications.

Topics of interest:
The special section seeks original contribution in, but not limited to, the following topics:

• Semiconductor design and optimization for IoT and edge computing
• Security and reliability enhancements in semiconductor systems
• Power efficiency and performance optimization in semiconductor devices
• Advanced semiconductor fabrication techniques (e.g., nanotechnology, quantum computing)
• Next-gen semiconductor materials and their applications
• Innovations in semiconductor packaging and interconnect technologies
• Simulation, modeling, and performance evaluation techniques for semiconductors
• Semiconductor-based artificial intelligence and machine learning applications
• Semiconductor innovations in automotive electronics and renewable energy systems
• Solutions for scalability and miniaturization challenges in semiconductor devices
• Advanced Packaging, Chiplet & Heterogeneous Integration Technologies Including 2.5D & 3D
• Analog and Mixed-Signal Circuits
• Beyond CMOS Devices That Utilize New Physics Including Spin, Optical & Quantum Computing
• Digital Circuits, Hardware Security, Signal Integrity & I/Os
• Sensors, Imagers, IoT, MEMS, Display Circuits
• Wireless and RF Devices, Circuits & Systems
• Power and Energy Circuits and Systems
• Neural Networks and Neuromorphic Engineering
• Beyond CMOS: Nanoelectronics and Heterogeneous System Integration
• Device/Packaging/Modeling and Testing Technologies

Session Co-chairs:

• Dr. Trung-Tin Tran (Swinburne University, Vietnam)
• Dr. Van Ha Nguyen (Dolphin Design, Canada)

Submission deadline: June 20, 2024
Contact: Dr Trung-Tin Tran (tintt19@fe.edu.vn)